I.S. EN 61189-3-719:2016现行
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies Part 3-719: Test Methods for Interconnection Structures (printed Boards) - Monitoring of Single Plated-through Hole (pth) Resistance Change During Temperature Cycling
出版：National Standards Authority of Ireland
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基本信息
标准编号： I.S. EN 61189-3-719:2016
发布时间：2016/4/26 0:00:00
标准类别：Standard
出版单位：National Standards Authority of Ireland
标准页数：36
标准简介
Defines a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
