I.S. EN 61190-1-2:2007被替代
Attachment Materials for Electronic Assembly - Part 1-2: Requirements for Solder Pastes for High-quality Interconnections in Electronics Assembly
出版：National Standards Authority of Ireland
专家解读视频
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly.
SS EN 61190-1-2 Ed. 1 (2003) - Identical
IEC 61190-1-2 Ed. 2.0 - Identical
NF EN 61190-1-2:2002 - Identical
DIN EN 61190-1-2 (2007-11) - Identical
BS EN 61190-1-2:2007 - Identical
NF EN 61190-1-2:2008 - Identical
SS EN 61190-1-2 Ed. 2 (2007) - Identical
EN 61190-1-2:2014 - Identical
