SS EN 61190-1-2 Ed. 1 (2003)被替代
Attachment Materials For Electronic Assemblies - Part 1-2: Requirements For Solder Pastes For High-quality Interconnections In Electronics Assembly
出版：Standardiserings-Kommissionen I Sverige
专家解读视频
Describes general requirements for the characterizationand testing of solder pastes used to make high-qualityelectronic interconnections in electronics assembly.
BS EN 61190-1-2:2007 - Identical
DIN EN 61190-1-2 (2007-11) - Identical
NF EN 61190-1-2:2002 - Identical
I.S. EN 61190-1-2:2007 - Identical
IEC 61190-1-2 Ed. 2.0 - Identical
