I.S. EN 61190-1-2:2014现行
Attachment Materials for Electronic Assembly Part 1-2: Requirements for Soldering Pastes for High-quality Interconnects in Electronics Assembly
出版：National Standards Authority of Ireland
专家解读视频
Defines general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly.
DIN EN 61190-1-2 : 2014 - Identical
BS EN 61190-1-2 : 2014 - Identical
BS EN 61190-1-2 : 2014 - Identical
IEC 61190-1-2 : 3.0 - Identical
NF EN 61190-1-2 : 2014 - Identical
EN 61190-1-2 : 2014 - Identical
DIN EN 61190-1-2 : 2014 - Identical
SS EN 61190-1-2 Ed. 3 (2014) - Identical
BS EN 61190-1-2:2014 - Identical
EN 61190-1-2:2014 - Identical
NF EN 61190-1-2:2014 - Identical
