NF EN 61190-1-2:2008被替代
Attachment Materials For Electronic Assembly - Part 1-2: Requirements For Soldering Paste For High-quality Interconnects In Electronics Assembly
出版：Association Francaise de Normalisation
专家解读视频
Describes general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly.
Indice de classement: C90-700-1-2. (10/2003) PR NF EN 61190-1-2 February 2006. (02/2006) 2002 version is still active. (06/2008)
DIN EN 61190-1-2 (2007-11) - Identical
BS EN 61190-1-2:2007 - Identical
SS EN 61190-1-2 Ed. 2 (2007) - Identical
IEC 61190-1-2 Ed. 2.0 - Identical
I.S. EN 61190-1-2:2007 - Identical
EN 61190-1-2:2014 - Identical
SS EN 61190-1-2 Ed. 3 (2014) - Identical
