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IEC 61190-1-2 Ed. 2.0被替代

Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

出版：International Electrotechnical Committee

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基本信息

标准编号： IEC 61190-1-2 Ed. 2.0

发布时间：2007/4/26 0:00:00

标准类别：Standard

出版单位：International Electrotechnical Committee

标准页数：37

标准简介

Specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. Serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Related information on flux characterization, quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

本标准替代的旧标准

IEC 61190-1-2 Ed. 1.0

替代本标准的新标准

IEC 61190-1-2 Ed. 3.0

等同采用的国际标准

CEI EN 61190-1-2 Ed. 1 (2003) - Identical

NF EN 61190-1-2:2002 - Identical

NF EN 61190-1-2:2008 - Identical

SS EN 61190-1-2 Ed. 1 (2003) - Identical

CEI EN 61190-1-2 Ed. 2 (2008) - Identical

DIN EN 61190-1-2 (2007-11) - Identical

BS EN 61190-1-2:2007 - Identical