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BS EN 60749-14:2003现行

Semiconductor devices. Mechanical and climatic test methods. Robustness of terminations (lead integrity)

出版：British Standards Institution

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基本信息

标准编号： BS EN 60749-14:2003

发布时间：2003/12/15 0:00:00

标准类别：Standard

出版单位：British Standards Institution

标准页数：18

标准简介

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

标准备注

本标准替代的旧标准

02/204667 DC : DRAFT APR 2002

BS EN 60749 : 1999

BS EN 60749:1999

等同采用的国际标准

DIN EN 60749-14 (2004-07) - Identical

EN 60749-14:2003 - Identical

SS EN 60749-14 Ed. 1 (2004) - Identical

IEC 60749-14 Ed. 1.0 - Identical

I.S. EN 60749-14:2003 - Identical

UNE EN 60749-14 : 2004 - Identical