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I.S. EN 60749-14:2003现行

Semiconductor Devices - Mechanical And Climatic Test Methods Part 14: Robustness Of Terminations (lead Integrity)

出版：National Standards Authority of Ireland

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基本信息

标准编号： I.S. EN 60749-14:2003

发布时间：2003/11/7 0:00:00

标准类别：Standard

出版单位：National Standards Authority of Ireland

标准页数：42

标准简介

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

等同采用的国际标准

NF EN 60749-14:2004 - Identical

EN 60749-14:2003 - Identical

UNE EN 60749-14:2004 - Identical

NBN EN 60749-14:2004 - Identical

BS EN 60749-14:2003 - Identical

UNE EN 60749-14 : 2004 - Identical

IEC 60749-14 : 1.0 - Identical

BS EN 60749-14 : 2003 - Identical

NBN EN 60749-14 : 2004 - Identical

DIN EN 60749-14 : 2004 - Identical

EN 60749-14 : 2003 - Identical