NEN EN IEC 61190-1-2:2007被替代
Attachment Materials For Electronic Assembly - Part 1-2: Requirements For Soldering Pastes For High-quality Interconnects In Electronics Assembly
出版：Nederlands Normalisatie Instituut
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基本信息
标准编号： NEN EN IEC 61190-1-2:2007
发布时间：2007/8/1 0:00:00
标准类别：Standard
出版单位：Nederlands Normalisatie Instituut
标准页数：18
标准简介
Defines general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. It serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
替代本标准的新标准
