IEC 61190-1-2 Ed. 1.0被替代
Attachment materials for electronic assembly Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
出版：International Electrotechnical Committee
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基本信息
标准编号： IEC 61190-1-2 Ed. 1.0
发布时间：2002/3/22 0:00:00
标准类别：Standard
出版单位：International Electrotechnical Committee
标准页数：35
标准简介
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
替代本标准的新标准
等同采用的国际标准
BS EN 61190-1-2:2002 - Identical
