I.S. EN 60749-21:2011现行
Semiconductor Devices - Mechanical and Climatic Test Methods Part 21: Solderability
出版：National Standards Authority of Ireland
专家解读视频
Constitutes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
NF EN 60749-21:2012 - Identical
SS EN 60749-21 Ed. 2 (2011) - Identical
NBN EN 60749-21:2011 - Identical
NF EN 60749-21:2005 - Identical
NBN EN 60749-21 : 2011 - Identical
DIN EN 60749-21 : 2012 - Identical
BS EN 60749-21 : 2011 - Identical
IEC 60749-21 : 2.0 - Identical
EN 60749-21 : 2011 - Identical
NF EN 60749-21 : 2012 - Identical
DIN EN 60749-21 : 2012 - Identical
BS EN 60749-21 : 2011 - Identical
EN 60749-21:2011 - Identical
