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IEC 60068-2-69 Ed. 2.0被替代

Environmental testing Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

出版：International Electrotechnical Committee

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基本信息

标准编号： IEC 60068-2-69 Ed. 2.0

发布时间：2007/5/9 0:00:00

标准类别：Standard

出版单位：International Electrotechnical Committee

标准页数：50

标准简介

Outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. Provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. The main changes from the previous edition are as follows: Inclusion of lead-free alloy test conditions; Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry in the past 20 years; Inclusion of new component types, and updating test parameters for the whole component list.

本标准替代的旧标准

IEC 60068-2-69 Ed. 1.0

替代本标准的新标准

IEC 60068-2-69 Ed. 3.0

等同采用的国际标准

UNE EN 60068-2-69:2007 - Identical

NF EN 60068 2-69:1998 - Identical

DIN EN 60068-2-69 (2007-11) - Identical

AS 60068.2.69-2004 - Identical

ONORM OVE EN 60068-2-69:1998 - Identical

SN EN 60068-2-69:1996 - Identical

CEI EN 60068-2-69 Ed. 2 (2008) - Identical