IEC 60068-2-69 Ed. 1.0被替代
Environmental testing Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
出版：International Electrotechnical Committee
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基本信息
标准编号： IEC 60068-2-69 Ed. 1.0
发布时间：1995/12/8 0:00:00
标准类别：Standard
出版单位：International Electrotechnical Committee
标准页数：43
标准简介
Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.
替代本标准的新标准
