
Environmental Testing - Part 2-69: Tests - Test Te: Solderability Testing Of Electronic Components For Surface Mounting Devices (smd) By The Wetting Balance Method
出版:Verband Deutscher Elektrotechniker

专家解读视频
Describes test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices.
Supersedes DIN IEC 60068-2-69. (11/2007) DRAFT 2014 issued in November 2014. (11/2014)
BS EN 60068-2-69:2017 - Identical
EN 60068-2-69:2017 - Identical
IEC 60068-2-69 Ed. 2.0 - Identical
SS EN 60068-2-69 Ed. 2 (2007) - Identical
SN EN 60068-2-69:1996 - Identical
BS EN 60068-2-69:2007 - Identical
I.S. EN 60068-2-69:2007 - Identical
UNE EN 60068-2-69:2007 - Identical