SS EN 61190-1-2 Ed. 2 (2007)被替代
Attachment Materials For Electronic Assemblies - Part 1-2: Requirements For Solder Pastes For High-quality Interconnections In Electronics Assembly
出版：Standardiserings-Kommissionen I Sverige
专家解读视频
Describes general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly.
1ED 2003 is still active. (01/2008)
DIN EN 61190-1-2 (2007-11) - Identical
BS EN 61190-1-2:2007 - Identical
NF EN 61190-1-2:2008 - Identical
IEC 61190-1-2 Ed. 2.0 - Identical
I.S. EN 61190-1-2:2007 - Identical
EN 61190-1-2:2014 - Identical
