BS EN 60749-15:2010现行
Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices
出版：British Standards Institution
专家解读视频
Defines a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
© British Standards Institution 2013
Amendment notes:
Corrigendum, June 2011
DIN EN 60749-15 : 2011 - Identical
SN EN 60749-15 : 2003 - Identical
I.S. EN 60749-15:2010 - Identical
I.S. EN 60749-15:2010 - Identical
NF EN 60749-15:2003 - Identical
SN EN 60749-15:2003 - Identical
SS EN 60749-15 Ed. 2 (2011) - Identical
UNE EN 60749-15:2011 - Identical
DIN EN 60749-15 (2011-06) - Identical
NF EN 60749-15:2011 - Identical
NBN EN 60749-15:2011 - Identical
EN 60749-15:2010 - Identical
I.S. EN 60749-15:2010 - Identical
IEC 60749-15 Ed. 2.0 - Identical
NBN EN 60749-15 : 2011 - Identical
EN 60749-15 : 2010 COR 2011 - Identical
DIN EN 60749-15 : 2011 - Identical
SN EN 60749-15 : 2003 - Identical
IEC 60749-15 : 2.0 - Identical
NF EN 60749-15 : 2011 - Identical
UNE EN 60749-15 : 2011 - Identical
