IEC 60749-15 : 2.0现行
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
出版：International Electrotechnical Committee
专家解读视频
Provides a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
DIN EN 60749-15 : 2011 - Identical
SN EN 60749-15 : 2003 - Identical
NEN EN IEC 60749-15 : 2011 C11 2011 - Identical
DS EN 60749-15 : 2011 COR 2011 - Identical
BS EN 60749-15 : 2010 - Identical
I.S. EN 60749-15:2010 - Identical
PN EN 60749-15 : 2011 AC 2011 - Identical
CEI EN 60749-15 : 2012 - Identical
