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IEC 60749-3 Ed. 1.0被替代

Semiconductor devices - Mechanical and climatic test methods Part 3: External visual inspection

出版：International Electrotechnical Committee

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基本信息

标准编号： IEC 60749-3 Ed. 1.0

发布时间：2002/4/9 0:00:00

标准类别：Standard

出版单位：International Electrotechnical Committee

标准页数：7

标准简介

Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The contents of the corrigendum of August 2003 have been included in this copy.

本标准替代的旧标准

IEC 60749 Ed. 2.0

IEC 60749 Amd.1 Ed. 2.0

IEC 60749 Ed. 2.2

IEC/PAS 62163 Ed. 1.0

替代本标准的新标准

IEC 60749-3 Ed. 2.0

等同采用的国际标准

OVE/ONORM EN 60749-3:2003 - Identical

NEN EN IEC 60749-3:2002 - Identical

SS EN 60749-3 Ed. 1 (2003) - Identical

PN EN 60749-3:2004 - Identical