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标准编号	标准名称	发布部门	发布日期	状态
DIN EN 61837-2 (2012-04)	Surface Mounted Piezoelectric Devices For Frequency Control And Selection - Standard Outlines And Terminal Lead Connections - Part 2: Ceramic Enclosures (iec 61837-2:2011)	German Ins..	2012-04-01	被替代
12/30240059 DC	BS EN IEC 62715-1-1. Flexible display devices. Terminology and letter symbols	British St..	2012-02-27	被替代
GOST 2.702:2011	Unified System For Design Documentation - Rules For Presentation Of Electric Schemes	Interstand..	2012-01-01	现行
DIN EN 60191-6-12 (2011-12)	Mechanical Standardization Of Semiconductor Devices - Part 6-12: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Design Guidelines For Fine-pitch Land Grid Array (flga) (iec 60191-6-12:2011)	German Ins..	2011-12-01	现行
DIN EN 60191-6-17 (2011-09)	Mechanical Standardization Of Semiconductor Devices - Part 6-17: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Design Guide For Stacked Packages - Fine-pitch Ball Grid Array And Fine-pitch Land Grid Array (p-pfbga And P-pflga)	German Ins..	2011-09-01	现行
DIN EN 60191-6-22 (2011-08)	Mechanical Standardization Of Semiconductor Devices - Part 6-22: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Design Guide For Semiconductor Packages Silicon Fine-pitch Ball Grid Array And Silicon Fine-pitch Land Grid Array (s-fbga And S-flga) (iec 47d/802/cd:2011)	German Ins..	2011-08-01	被替代
BS EN 60191-6-17:2011	Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)	British St..	2011-06-30	现行
DIN EN 60191-6-20 (2011-03)	Mechanical Standardization Of Semiconductor Devices - Part 6-20: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Measuring Methods For Package Dimensions Of Small Outline J-lead Packages (soj)	German Ins..	2011-03-01	现行
DIN EN 60191-6-21 (2011-03)	Mechanical Standardization Of Semiconductor Devices - Part 6-21: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Measuring Methods For Package Dimensions Of Small Outline Packages (sop)	German Ins..	2011-03-01	现行
11/30242512 DC	BS EN 60848. GRAFCET specification language for sequential function charts	British St..	2011-01-28	被替代
DS HDBK 166-1:2010	Industrial Systems, Installations And Equipment And Industrial Products - Structuring Principles And Reference Designations	Danish Sta..	2010-09-08	现行
DS HDBK 166:2010	A Guide To Reference Designations - Preparation Of Tag Numbers, Letter Codes, Modularization And Interfaces Between Systems	Danish Sta..	2010-09-02	被替代
PN EN 60191-6:2010	Mechanical Standardization Of Semiconductor Devices - Part 6: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages	Polish Com..	2010-08-25	现行
DIN EN 60191-6-18 (2010-08)	Mechanical Standardization Of Semiconductor Devices - Part 6-18: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Design Guide For Ball Grid Array (bga)	German Ins..	2010-08-01	现行
DIN IEC 60191-6-1 (2010-07)	Mechanical standardization of semiconductor devices Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals (IEC 47D/770/CD:2010)	German Ins..	2010-07-01	废止
DIN EN 60191-6 (2010-06)	Mechanical Standardization Of Semiconductor Devices - Part 6: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages	German Ins..	2010-06-01	现行
10/30227781 DC	BS EN 60191-6-1. Mechanical standardization of semiconductor devices. Part 6-1. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals	British St..	2010-05-06	现行
DIN IEC 60191-6-12 (2010-04)	Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) (IEC 47D/763/CD:2010)	German Ins..	2010-04-01	被替代
DIN IEC 61240 (2010-03)	Piezoelectric devices - Preparation of outline drawings of surface mounted devices (SMD) for frequency control and selection - General rules (IEC 49/894/CD:2009)	German Ins..	2010-03-01	被替代
10/30215537 DC	BS EN 60191-6-12. Mechanical standardization of semiconductor devices. Part 6-12. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitch land grid array (FLGA). Rectangular type	British St..	2010-01-12	被替代

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