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每页显示20 条,共找到 122 条结果 <3/7>
标准编号 标准名称 发布部门 发布日期 状态
AS/NZS 3000:2007/Amdt 1:2009 Electrical installations (known as the Australian/New Zealand Wiring Rules) Standards .. 2009-07-30 现行
DS HDBK 166-2:2009 Guideline To Reference Designations - A Handbook About Tag-Numbering, Letter Codes, Modulization And Interfaces Danish Sta.. 2009-04-01 被替代
DIN-FACHBERICHT IEC/PAS 62515 (2008-12) Requirements Concerning The Interoperability Between Electromechanical And Electrical Applications In Cax-systems German Ins.. 2008-12-01 现行
GB 300-2008 Guide to Changes in the AS/NZS 3000:2007 Wiring Rules SAI Global 2008-03-12 现行
DIN IEC 60191-6-18 (2008-03) Mechanical standardization of semiconductor devices Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 47D/708/CD:2007) German Ins.. 2008-03-01 被替代
BS EN 60191-6-13:2007 Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for fine-pitch ball grid array and fine-pitch land grid array (FBGA/FLGA) British St.. 2008-01-31 被替代
I.S. EN 60191-6-13:2007 Mechanical Standardization of Semiconductor Devices Part 6-13: Design Guideline of Open-top-type Sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (fbga/flga) National S.. 2008-01-30 被替代
AS/NZS 3000:2007 (Unamended) Electrical installations (known as the Australian/New Zealand Wiring Rules) Standards .. 2007-11-12 现行
AS/NZS 3000:2007 Electrical installations (known as the Australian/New Zealand Wiring Rules) Standards .. 2007-11-12 现行
DIN IEC 60191-6 (2007-11) Mechanical standardization of semiconductor devices Part 6 : General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/694/CD:2007) German Ins.. 2007-11-01 被替代
VG 95340-2:2007 Complete Circuit Diagram - Part 2: Installation Of Power Installations In Cabins And Motorcar Box Bodies, 220 V, 50 Hz, 16 A, Interface Standard Bundesamt .. 2007-09-01 被替代
VG 95340-1:2007 Complete Circuit Diagram - Part 1: Installation Of Power Installations In Cabins And Motorcar Box Bodies, 400/230 V, 50 Hz, 32 A, Interface Standard Bundesamt .. 2007-09-01 被替代
DS EN 61082-1:2007 Preparation Of Documents Used In Electrotechnology - Part 1: Rules Danish Sta.. 2007-03-28 被替代
NF EN 61082-1:2006 Preparation Of Documents Used In Electrotechnology - Part 1: Rules Associatio.. 2006-11-01 被替代
VG 95001-8:2006 Drawing Set - Part 8: Code Letters For Type Of Documents Bundesamt .. 2006-09-01 被替代
NF EN 61988-3-1:2006 Plasma Display Panels - Part 3-1: Mechanical Interface Associatio.. 2006-03-01 现行
05/30136813 DC IEC 60191-2/F63 ED 1. Proposed new package outline, power package with 34 pins British St.. 2005-07-21 废止
05/30136816 DC IEC 60191-2/F62 ED 1. Proposed new package outline, power package with 17 pins British St.. 2005-07-21 废止
DIN EN 60191-6 (2005-04) Mechanical Standardization Of Semiconductor Devices - Part 6: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages German Ins.. 2005-04-01 被替代
PN EN 60191-6:2005 Mechanical Standardization Of Semiconductor Devices - Part 6: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages Polish Com.. 2005-03-15 被替代
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