BS EN 60191-6-17:2011现行
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
出版：British Standards Institution
专家解读视频
Gives outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
© British Standards Institution 2013
IEC 60191-6-17 Ed. 1.0 - Identical
IEC 60191-6-17 : 1.0 - Identical
EN 60191-6-17 : 2011 - Identical
