IEC 61190-1-2 : 3.0现行
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
出版：International Electrotechnical Committee
专家解读视频
Defines general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly.
BS EN 61190-1-2 : 2014 - Identical
NBN EN 61190 1-2 : 2014 - Identical
CEI EN 61190-1-2 : 2015 - Identical
PN EN 61190-1-2 : 2014 - Identical
DIN EN 61190-1-2 : 2014 - Identical
NEN EN IEC 61190-1-2 : 2014 - Identical
UNE EN 61190-1-2 : 2014 - Identical
I.S. EN 61190-1-2:2014 - Identical
DS EN 61190-1-2 : 2014 - Identical
SN EN 61190-1-2 : 2014 - Identical
