IEC 62047-2 Ed. 1.0现行
Semiconductor devices - Micro-electromechanical devices Part 2: Tensile testing method of thin film materials
出版：International Electrotechnical Committee
专家解读视频
Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.
BS EN 62047-2:2006 - Identical
DIN EN 62047-2 (2007-02) - Identical
NF EN 62047-2:2006 - Identical
I.S. EN 62047-2:2006 - Identical
PN EN 62047-2:2006 - Identical
NEN EN IEC 62047-2:2006 - Identical
OVE/ONORM EN 62047-2:2007 - Identical
