IEC 60191-6-17 Ed. 1.0现行
Mechanical standardization of semiconductor devices Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
出版：International Electrotechnical Committee
专家解读视频
基本信息
标准编号： IEC 60191-6-17 Ed. 1.0
发布时间：2011/1/27 0:00:00
标准类别：Standard
出版单位：International Electrotechnical Committee
标准页数：53
标准简介
IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
等同采用的国际标准
BS EN 60191-6-17:2011 - Identical
