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EN 60191-6-17 : 2011现行

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRI

出版:European Committee for Standards - Electrical

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基本信息
标准编号: EN 60191-6-17 : 2011
标准类别:Standard
出版单位:European Committee for Standards - Electrical
标准页数:0
标准简介

Gives outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.