
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 2: LOW AIR PRESSURE
出版:International Electrotechnical Committee

专家解读视频
Covers the testing of low air pressure on semiconductor devices. The test is intended primarily to determine the ability of component parts and materials to avoid voltage breakdown failures due to the reduced dielectric strength of air and other insulating materials at reduced pressures is only applicable to devices where the operating voltage exceeds 1000 V. This test is applicable to all semiconductor devices provided they are in cavity type packages. The test is intended for military and space-related applications only.
PN EN 60749-2 : 2004 - Identical
CEI EN 60749-2 : 2004 - Identical
BS EN 60749-2 : 2002 - Identical
DS EN 60749-2 : 2002 COR 1 2003 - Identical
NEN EN IEC 60749-2 : 2002 - Identical
DIN EN 60749-2 : 2003 - Identical
I.S. EN 60749-2:2002 - Identical