I.S. EN 60749-15:2003被替代
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 15: Resistance To Soldering Temperature For Through-hole Mounted Devices
出版：National Standards Authority of Ireland
专家解读视频
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
UNE EN 60749-15:2003 - Identical
SS EN 60749-15 Ed. 1 (2003) - Identical
IEC 60749-15 Ed. 1.0 - Identical
NF EN 60749-15:2003 - Identical
NBN EN 60749-15:2004 - Identical
DIN EN 60749-15 (2003-10) - Identical
BS EN 60749-15:2003 - Identical
SN EN 60749-15:2003 - Identical
