IEC 60749-15 Ed. 1.0被替代
Semiconductor devices - Mechanical and climatic test methods Part 15: Resistance to soldering temperature for through-hole mounted devices
出版：International Electrotechnical Committee
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基本信息
标准编号： IEC 60749-15 Ed. 1.0
发布时间：2003/2/7 0:00:00
标准类别：Standard
出版单位：International Electrotechnical Committee
标准页数：11
标准简介
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
替代本标准的新标准
