IEC 60749-21 : 2.0现行
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
出版：International Electrotechnical Committee
专家解读视频
Covers a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
NEN EN IEC 60749-21 : 2011 - Identical
DIN EN 60749-21 : 2012 - Identical
BS EN 60749-21 : 2011 - Identical
PN EN 60749-21 : 2011 - Identical
CEI EN 60749-21 : 2012 - Identical
I.S. EN 60749-21:2011 - Identical
DS EN 60749-21 : 2011 - Identical
