
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
出版:British Standards Institution

专家解读视频
Gives standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.
© British Standards Institution 2013
IEC 60191-6-12 Ed. 2.0 - Identical
SS EN 60191-6-12 Ed. 2 (2012) - Identical
UNE EN 60191-6-12:2004 - Identical
I.S. EN 60191-6-12:2011 - Identical
DIN EN 60191-6-12 : 2011 - Identical
I.S. EN 60191-6-12:2011 - Identical
UNE EN 60191-6-12 : 2004 - Identical
DIN EN 60191-6-12 : 2011 - Identical
IEC 60191-6-12 : 2.0 - Identical
NF EN 60191-6-12 : 2012 - Identical
EN 60191-6-12 : 2011 - Identical