IEC 60191-6-12 : 2.0现行
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDELINES FOR FINE-PITCH LAND GRID ARRAY (FLGA)
出版：International Electrotechnical Committee
专家解读视频
Gives standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.
DS EN 60191-6-12 : 2011 - Identical
DIN EN 60191-6-12 : 2011 - Identical
CEI EN 60191-6-12 : 2012 - Identical
NEN EN IEC 60191-6-12 : 2011 - Identical
NBN EN 60191 6-12 : 2011 - Identical
PN EN 60191-6-12 : 2012 - Identical
BS EN 60191-6-12 : 2011 - Identical
I.S. EN 60191-6-12:2011 - Identical
