
Mechanical Standardization Of Semiconductor Devices - Part 6-12: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Design Guide For Fine-pitch Land Grid Array (flga) - Rectangular Type
出版:Asociacion Espanola de Normalizacion

专家解读视频
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
SS EN 60191-6-12 Ed. 1 (2003) - Identical
IEC 60191-6-12 Ed. 1.0 - Identical
I.S. EN 60191-6-12:2002 - Identical
NF EN 60191-6-12:2002 - Identical
DIN EN 60191-6-12 (2003-01) - Identical
BS EN 60191-6-12:2002 - Identical
I.S. EN 60191-6-12:2011 - Identical
BS EN 60191-6-12:2011 - Identical
DIN EN 60191-6-12 (2011-12) - Identical
NF EN 60191-6-12:2012 - Identical
SS EN 60191-6-12 Ed. 2 (2012) - Identical