
Mechanical Standardization Of Semiconductor Devices - Part 6-12: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Design Guide For Fine-Pitch Land Grid Array (Flga)
出版:Association Francaise de Normalisation

专家解读视频
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
Indice de classement: C96-013-6-12. (12/2002) PR NF EN 60191-6-12 February 2011. (03/2011) 2002 version is still active. (03/2012)