IEC 60191-5 Ed. 2.0现行
Mechanical standardization of semiconductor devices Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
出版：International Electrotechnical Committee
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基本信息
标准编号： IEC 60191-5 Ed. 2.0
发布时间：1997/4/23 0:00:00
标准类别：Standard
出版单位：International Electrotechnical Committee
标准页数：71
标准简介
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
本标准替代的旧标准
