IEC 191-5 Ed. 1.0被替代
Mechanical Standardization Of Semiconductor Devices - Recommendations Applying To Tape Automated Bonding (tab) Of Integrated Circuits
出版：International Electrotechnical Committee
专家解读视频
Gives recommendations applying to tape automated bonding (TAB) of integrated circuits. Dimension values or requirements given in this standard for tape width, perforations, test pattern, outer lead bonding (OLB), etc., correspond to the state of the market at the date of edition of this standard. More especially, tape width and perforation dimensions have been derived from motion picture film standards. Progress in integrated circuit (IC) technology resulting in a higher number of terminals and user requirements may lead in the future to recommend additional or new dimensions.
BS DRAFT 93/216730 DC REFERS TO A NEW REVISION
BS 3934-5:1992 - Identical
