IEC 60191-4 Ed. 3.1现行
Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
出版：International Electrotechnical Committee
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基本信息
标准编号： IEC 60191-4 Ed. 3.1
发布时间：2018/3/27 0:00:00
标准类别：Standard
出版单位：International Electrotechnical Committee
标准页数：158
标准简介
IEC 60191-4:2013 defines a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.
本标准替代的旧标准
