IEC 60191-4 Ed. 3.0现行
Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
出版：International Electrotechnical Committee
专家解读视频
IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition: a) Material code ""S"" is added to indicate a silicon based package. b) Description of ""WL"" is added to be used for gener
