BS EN 61189-5-4:2015现行
Test Methods For Electrical Materials, Printed Boards And Other Interconnection Structures And Assemblies - Part 5-4: General Test Methods For Materials And Assemblies - Solder Alloys And Fluxed And Non-Fluxed Solid Wire For Printed Board Assemblies
出版：British Standards Institution
专家解读视频
Defines methodologies and procedures that can be applied to test printed board assemblies.
Supersedes 12/30274804 DC. Renumbers and supersedes BS IEC 61189-5-4. 2015 Version incorporates corrigendum to BS IEC 61189-5-4. (04/2015)
EN 61189-5-4:2015 - Identical
IEC 61189-5-4 : 1ED 2015 - Identical
EN 61189-5-4 : 2015 - Identical
