
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
出版:International Electrotechnical Committee

专家解读视频
Specifies methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6.
BS EN 61189-5-4 : 2015 - Identical
DIN EN 61189-5-4 : 2015 - Identical
NBN EN 61189-5-4 : 2015 - Identical
DS EN 61189-5-4 : 2015 - Identical
CEI EN 61189-5-4 : 2016 - Identical
NEN EN IEC 61189-5-4 : 2015 - Identical
NF EN 61189-5-4 : 2015 - Identical