DIN EN 61189-3-719 (2014-04)被替代
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling (IEC 91/1152/CD:2013)
出版：German Institute for Standardisation (Deutsches Institut für Normung)
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