
Mechanical standardization of semiconductor devices. Recommendations for tape automated bonding (TAB) of integrated circuits
出版:British Standards Institution

专家解读视频
Recommendations cover the requirements resulting from the sale of tape with or without bonded integrated circuits by a manufacturer to a user. They are not intended to govern strictly internal usage such as the use of TAB as one step in the manufacture of DIL packages or 'chip carriers'.
© British Standards Institution 2013
IEC 191-5 Ed. 1.0 - Identical