DS EN 60749-14:2003现行
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 14: Robustness Of Terminations (Lead Integrity)
出版：Danish Standards
专家解读视频
基本信息
标准编号： DS EN 60749-14:2003
发布时间：2004/3/15 0:00:00
标准类别：Standard
出版单位：Danish Standards
标准页数：24
标准简介
Specifies various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.
等同采用的国际标准
EN 60749-14:2003 - Identical
