J STD 033:2007被替代
Handling, Packing, Shipping And Use Of Moisture/reflow Sensitive Surface Mount Devices
出版：Institute of Printed Circuits
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基本信息
标准编号： J STD 033:2007
标准类别：Standard
出版单位：Institute of Printed Circuits
标准页数：0
标准简介
Provides SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMD packages that have been classified to the levels defined in J-STD-020.
标准备注
B.1 2007 Edition incorporates Amendment 1 to B2005 Edition. Also available in CD-ROM format. (04/2010)
替代本标准的新标准
