IPC SM 786:1995被替代
Procedures For Characterizing And Handling Of Moisture/reflow Sensitive Ics
出版：Institute of Printed Circuits
专家解读视频
基本信息
标准编号： IPC SM 786:1995
标准类别：Standard
出版单位：Institute of Printed Circuits
标准页数：0
标准简介
Pools the resources of component manufacturers and users to provide a cohesive problem statement and a consensus on what steps should be taken to prevent component cracking. Describes the extent of the problem within the industry, review its history, and discusses cracking failure modes. Provides recommendations on handling plastic chip carriers in order to reduce cracking problems. Also included is a test method that may be used to evaluate cracking susceptibility.
标准备注
classification criteria only is superseded by J-STD-020
