
Handling, Packing, Shipping And Use Of Moisture, Reflow, And Process Sensitive Devices
出版:Institute of Printed Circuits

专家解读视频
D2018 [30/04/2018]C-1 2014 [01/08/2014]C2012 [01/02/2012]B.1 2007 [01/01/2007]B2005 [01/10/2005]A2002 [01/07/2002]99 [01/04/1999]
Supersedes IPC SM 786 & EIA JEP 124. B.1 2007 Edition is still available in Russian and Italian Languages, See separate records. (02/2012) C2012 Edition is still available in Hungarian, German & Chinese Languages, See separate records. (10/2014) Jointly Published by IPC and JEDEC. (05/2016)