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J STD 033:2018现行

Handling, Packing, Shipping And Use Of Moisture, Reflow, And Process Sensitive Devices

出版:Institute of Printed Circuits

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基本信息
标准编号: J STD 033:2018
标准类别:Standard
出版单位:Institute of Printed Circuits
标准页数:28
标准简介

D2018 [30/04/2018]C-1 2014 [01/08/2014]C2012 [01/02/2012]B.1 2007 [01/01/2007]B2005 [01/10/2005]A2002 [01/07/2002]99 [01/04/1999]

标准备注

Supersedes IPC SM 786 & EIA JEP 124. B.1 2007 Edition is still available in Russian and Italian Languages, See separate records. (02/2012) C2012 Edition is still available in Hungarian, German & Chinese Languages, See separate records. (10/2014) Jointly Published by IPC and JEDEC. (05/2016)

本标准替代的旧标准

J STD 033:2014