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J STD 033:2014被替代

Handling, Packing, Shipping And Use Of Moisture/Reflow Sensitive Surface Mount Devices

出版:Institute of Printed Circuits

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基本信息
标准编号: J STD 033:2014
发布时间:2014/8/1 0:00:00
标准类别:Standard
出版单位:Institute of Printed Circuits
标准页数:28
标准简介

C-1 2014 [01/08/2014]C2012 [01/02/2012]B.1 2007 [01/01/2007]B2005 [01/10/2005]A2002 [01/07/2002]99 [01/04/1999]

标准备注

Supersedes IPC SM 786 & EIA JEP 124. Also available in CD-ROM format. Included in IPC C 103 & IPC C 1000 (11/2010) B.1 2007 Edition is still available in Russian and Italian Languages, See separate records. Jointly Published by IPC and JEDEC. (02/2012) C2012 Edition is still available in Hungarian, German & Chinese Languages, See separate records. (10/2014)

本标准替代的旧标准

J STD 033:2012

替代本标准的新标准

J STD 033:2018