EIA JESD 22-B109:2014现行
Flip Chip Tensile Pull
出版：JEDEC Solid State Technology Association
专家解读视频
基本信息
标准编号： EIA JESD 22-B109:2014
发布时间：2014/7/1 0:00:00
标准类别：Standard
出版单位：JEDEC Solid State Technology Association
标准页数：16
标准简介
Describes test method applicable to flip chip die after the die and substrate solder joint is formed, but prior to application of underfill or other materials that increase the apparent bond strength. Used to assess the consistency and quality of the chip join process and solder joint integrity across a given flip chip die. Covers both Pb and Pb-free solder bumps.
标准备注
Supersedes EIA JESD 22 (07/2004)
本标准替代的旧标准
