NEN EN IEC 60749-15:2003被替代
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 15: Resistance To Soldering Temperature For Through-hole Mounted Devices
出版：Nederlands Normalisatie Instituut
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基本信息
标准编号： NEN EN IEC 60749-15:2003
发布时间：2003/6/1 0:00:00
标准类别：Standard
出版单位：Nederlands Normalisatie Instituut
标准页数：11
标准简介
Defines a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
替代本标准的新标准
等同采用的国际标准
IEC 60749-15 Ed. 1.0 - Identical
