IEC 60512-6-2 Ed. 1.0现行
Connectors for electronic equipment - Tests and measurements Part 6-2: Dynamic stress tests - Test 6b: Bump
出版：International Electrotechnical Committee
专家解读视频
Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.
OVE/ONORM EN 60512-6-2:2003 - Identical
NEN EN IEC 60512-6-2:2002 - Identical
SS EN 60512-6-2 Ed. 1 (2002) - Identical
PN EN 60512-6-2:2006 - Identical
I.S. EN 60512-6-2:2002 - Identical
NF EN 60512-6-2:2002 - Identical
JIS C 5402-6-2:2005 - Identical
BS EN 60512-6-2:2002 - Identical
CEI EN 60512-6-2 Ed. 1 (2003) - Identical
DIN EN 60512-6-2 (2003-01) - Identical
UNE EN 60512-6-2:2002 - Identical
