DIN IEC 47-1425-CD (1998-11)被替代
Amendment To Iec 60749 "update Of Chapter 2 Subclause 2.3: Resistance Of Plastic Encapsulated Smds To The Combined Effect Of Moisture And Soldering Heat" And Of Chapter 3 Clause 5: "sealing"
出版：German Institute for Standardisation (Deutsches Institut für Normung)
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